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MASTERLIQUID ML360 SUB-ZERO
The MasterLiquid ML360 Sub-Zero powered by Intel® Cryo Cooling Technology delivers a cooling solution unlike that of your traditional thermal solutions. Allowing the processor to be able to reach higher frequencies at lower voltages due to behavioral characteristics of silicon that can only be achieved through sub-ambient temperatures. Utilizing the unique combination of hardware, software and firmware to push the thermal limitations of your processor.
Playing with the properties of Silicon to deliver a more optimized way to achieve over-clocking but not in the traditional sense. Unlike using solutions such as liquid nitrogen, the Sub-Zero is designed to allow gamers and content creators to achieve those higher frequencies while giving off less heat and ability to run at high frequencies as usual while using less power.
The ML360 Sub-Zero pushes the thermal boundaries of standard cooling solutions while adapting to the limitations of being a closed loop liquid cooler. This will allow for maximum potential of your CPU to realized, especially during low core count OC that can only be done with sub-ambient cooling. Cryo-Clocking pushes the frontier on innovation by introducing a sub-ambient cooling solution, unique in design and technology driven.
Sub-Ambient Cooling
Specifically designed using Thermoelectric Unit (TEC) to cool your processor and create the conditions that allow it to achieve low core count over-clocking.
Powered by Intel Cryo Cooling Technology
Designed with a simple user interface making it easy to understand and control the sub-ambient cooling potential.
Cryo-Clocking
Silicon can reach higher frequencies at lower voltages that can only be achieved through sub-ambient cooling. The concept of Cryo-Clocking is to push the performance of the CPU to reach maximum capacity within the limits.
2nd Generation Pump
Enhanced pump delivers higher liquid flow for exceptional heat removal.
High Performance Air Balance fans designed to spin at low rpm with great air pressure to air flow ratio. With a 360 radiator to dissipate heat efficiently.
SPECIFICALLY DESIGNED WATER BLOCK
The circuit board features built in sensors for temperature and dew point to help minimize the effects of condensation.
52x52mm TEC unit is built-in to the water block to cool you CPU.
Sensors communicate temperature and humidity conditions back to the system.
This seal maintains steady processing performance, as well as preventing condensation and external elements to protect your system.
